Private Market View

Hengfeng New Materials

Shanghai, China · Founded 2018 · Privately Held (backing)

Last price · $/share
Implied valuation
$3.1M
Total raised
$28.9M
Last round

Key facts

  • Hengfeng New Materials’s last known valuation is $3.1M (Aug 2021).
  • It has raised $28.9M; the latest was Later Stage VC ($14.3M) in Jan 2026.
  • Notable investors include Suzhou Oriza Holdings Corporation, Addor Capital, Yonghua Capital, CRRC Capital Holding, Galaxy Innovation Capital Management10 tracked in total.
  • Status: Privately Held (backing).
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Funding rounds

No rounds on record

No funding rounds for Hengfeng New Materials are on record yet — either the company hasn't raised institutional capital, or the raise hasn't surfaced in our sources.

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About Hengfeng New Materials

Developer of special epoxy resin designed for different industries. The company's products mainly focus on electronic grade phenolic and specialty epoxy resins, which are core raw materials for semiconductor packaging materials, copper-clad laminates, and photoresists, providing customers with innovative products.

Sector
Materials and Resources
HQ
Shanghai, China
Founded
2018
Employees
4
Ownership
Privately Held (backing)
PA Mark — not yet priced

Hengfeng New Materials doesn't have a composite mark yet — a PA Mark is published once enough pricing inputs exist (trade prints, fund marks, round prices). The rest of the record below builds toward it.

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Recorded secondary trades

No prints on record

No secondary trades in Hengfeng New Materials shares have been recorded yet. When a print lands — third-party, direct report, or platform — it appears here with structure, source, and price.

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Institutional fund marks

No fund marks yet

No SEC-registered fund has reported a fair-value mark on Hengfeng New Materials in its N-PORT filings yet. We sweep new filings monthly.

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