Private Market View

Lotus Thermal Solution

Osaka, Japan · Founded 2016 · Privately Held (backing)

Last price · $/share
Implied valuation
$13.6M
Total raised
$4.6M
Last round

Key facts

  • Lotus Thermal Solution’s last known valuation is $13.6M (Aug 2020).
  • It has raised $4.6M; the latest was Later Stage VC ($3.2M) in Jan 2026.
  • Notable investors include Iwatani Venture Capital, Elematec, Iwatani, JX Advanced Metals.
  • Status: Privately Held (backing).
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Funding rounds

No rounds on record

No funding rounds for Lotus Thermal Solution are on record yet — either the company hasn't raised institutional capital, or the raise hasn't surfaced in our sources.

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About Lotus Thermal Solution

Manufacturer of compact heat sinks designed to solve all heat problems. The company utilizes proprietary technology to cast metal with a large number of fine pores by dissolving hydrogen gas in molten metal, such as copper, and cooling it to offer heat sinks with a lotus-type porous thermal design, providing clients with efficient compact thermal services for industrial use cases.

Sector
Business Products and Services (B2B)
HQ
Osaka, Japan
Founded
2016
Employees
10
Ownership
Privately Held (backing)
PA Mark — not yet priced

Lotus Thermal Solution doesn't have a composite mark yet — a PA Mark is published once enough pricing inputs exist (trade prints, fund marks, round prices). The rest of the record below builds toward it.

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Recorded secondary trades

No prints on record

No secondary trades in Lotus Thermal Solution shares have been recorded yet. When a print lands — third-party, direct report, or platform — it appears here with structure, source, and price.

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Institutional fund marks

No fund marks yet

No SEC-registered fund has reported a fair-value mark on Lotus Thermal Solution in its N-PORT filings yet. We sweep new filings monthly.

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